LED Flower: Unterschied zwischen den Versionen

Version vom 25. Dezember 2010, 15:18 Uhr

PCB

BOM

Necessary

Designator	Value	Part-No	Price / EUR	Count	Sum / EUR
R1	3.6 kΩ, 1206	R:	0.01	1	0.01
R2	2.7 kΩ, 1206	R:	0.01	1	0.01
R3, R4	68 Ω, 1%, 1206	CSD: 10-120068	0.01	2	0.02
R5..R19, R38..R40	3.6 kΩ, 1206	R:	0.01	18	0.18
R20..R31	100 Ω, 1206	R:	0.01	12	0.12
R32..R37	150 Ω, 1206	R:	0.01	6	0.06
B1..B3	0 Ω, 1206	R:	0.01	3	0.03
T1..T18	BC807-25, SOT23	R: BC 807-25 SMD	0.04	18	0.72
C1, C2, C3	100 nF, 16 V, 0603	R: X7R-G0603 100N	0.05	3	0.15
C4, C5	22 pF, 0603	R: NPO-G0603 22P	0.05	2	0.10
C6	10 uF, 10 V, 0805	R: X5R-G0805 10/16	0.07	1	0.07
C9	100 nF, 63 V, 1206	R: X7R-G1206 100N	0.05	1	0.05
D2, D3	3.6 V Zener Diode, MiniMELF	R: SMD ZF 3,6	0.05	2	0.10
X1	20 MHz	R: 20,0000-HC49U-S	0.18	1	0.18
ISP, ADC, PWR	12-pin break-away connector (from a 36-pin strip)	R: SL 1X36W 2,54	0.27	1	0.27
CONN_USB	USB B connector	R: USB BW	0.21	1	0.21
U1	ATmega88-20AU	R: ATMEGA 88-20 AU	2.95	1	2.95
LED1..LED6	RGB LED	?	0.30	6	1.80
24 Copper wires	40 cm copper wire cutoff	R: CUL 500/0,63	13.90	0.058	0.81
Sum					7.84

Version 1: USB Powered

Designator	Value	Part-No	Price / EUR	Count	Sum / EUR
L1	10 uH, 450 mA, 1210	CSD: 146-121R010	0.22	1	0.22
U2, C7, C8	Do not populate		0.00	0	0.00
Sum					0.22

Version 2: Externally powered

Designator	Value	Part-No	Price / EUR	Count	Sum / EUR
U2	LM1117-5.0	CSD: LM1117DT-5,0V	0.95	1	0.95
C7, C8	10 uF, 10 V, 0805	R: X5R-G0805 10/16	0.07	3	0.21
D1	1N4001, MELF	R: X7R-G1206 100N	0.04	1	0.04
L1	Do not populate		0.00	0	0.00
Sum					1.20

Option: Button

Designator	Value	Part-No	Price / EUR	Count	Sum / EUR
R41	3.6 kΩ, 1206	R:	0.01	1	0.01
BTN	Pushbutton	?	0.10	1	0.10
Sum					0.11

Tutorial

Soldering Microcontroller and Basic Parts

The first step in soldering this board is also the most difficult: Soldering the microcontroller. We are going to use the drag soldering technique. To do so, we first place the microcontroller on the board to get an idea of how it should be placed afterwards. Note the pin one mark which is a small dip in one corner of the IC. This is used to orient it correctly:

Now remove the microcontroller again, select one pad of the pcb and tin it. For this and the next two steps, you don't have to worry about any solder bridges, we will remove them afterwards.

Now grab the microcontroller with a pair of tweezers, heat up the tinned pad and place the microcontroller correctly. Do not overheat the microcontroller: If you are not able to position the microcontroller within about 10 seconds remove the soldering iron and try again after waiting a short amount of time.

To further secure it, also solder one pin on the opposite corner.

@@ Zeile 252: / Zeile 252: @@
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-Now remove the microcontroller again, select one pad of the pcb and tin it:
+Now remove the microcontroller again, select one pad of the pcb and tin it. For this and the next two steps, you don't have to worry about any solder bridges, we will remove them afterwards.
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